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PCB Design
Capabilities
Recent design experience includes the following:
- High-speed digital designs up to 10GHz
- 10/100 Ethernet, GigE, 10GigE, XAUI, PCI-X, PCIe, RapidIO
- Memory - DDR, DDR2, DDR3, QDR, DIMM, RDIMM, FB-DIMM, SO-DIMM
- Extremely dense, high pincount, small form factor PCB's
- HDI blind/burried/micro vias
- 24 layers, dual thickness, exotic dielectrics
- Multi-chip modules, flip-chip and chip on board
- Linecards and Backplanes
- all flavours of Chip Scale Packaging
Example Projects
| Verification DIMM
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| | Size:
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| 5.25"x2.00"
| | Thickness:
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| 0.050"
| | Layers:
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| 10
| | Nets:
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| 3956
| | Components:
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| 789
| | Lands:
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| 4093
| | Vias:
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| 2645
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18x4Gb 1333MHz DualDie DDR3
0.65mm pitch Register/Clock ASIC
0.50mm pitch Interface IC ASIC x9
Detachable debug circuit
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| 10GbE Linecard
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| | Size:
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| 5.25"x6.30"
| | Thickness:
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| 0.093"
| | Layers:
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| 14
| | Nets:
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| 3949
| | Components:
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| 1258
| | Lands:
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| 4284
| | Vias:
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| 3058
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10Gb/s Serial Data Transmission, dual XFP tranceivers, XAUI mux/demux
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| CPU Mezzanine Card
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| | Size:
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| 4.0"x7.0"
| | Thickness:
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| 0.063"
| | Layers:
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| 12
| | Nets:
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| 4826
| | Components:
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| 988
| | Lands:
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| 5209
| | Vias:
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| 3263
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FreeScale CPU, DDR2, GiGE, XAUI, CompactFlash, BGA Mezzanine connector.
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| PCI-X x64 Card
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| | Size:
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| 4.2"x12.28"
| | Thickness:
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| 0.093",0.062" (dual)
| | Layers:
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| 22
| | Nets:
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| 14336
| | Components:
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| 3814
| | Lands:
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| 15027
| | Vias:
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| 21068
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| thru/blind/micro
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0.093" PCI card that mates with a 0.062" edge connector. Other challenges: component density, thermal management, and power distribution
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| Multi-Chip Module (MCM)
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| | Size:
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| 31mm x 31mm
| | Thickness:
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| 1mm
| | Layers:
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| 8
| | Nets:
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| 1032
| | Components:
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| 491
| | Lands:
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| 1047
| | Vias:
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| 1132
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| thru/blind/micro
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| cPCI Active Backplane
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| | Size:
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| 16.75" x 10.32"
| | Thickness:
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| 0.93"
| | Layers:
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| 20
| | Nets:
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| 11851
| | Components:
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| 491
| | Lands:
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| 12978
| | Vias:
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| 7505
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One of five PCB's designed for a custom ASIC evaluation platform based on the CompactPCE form factor. Project also included thermal analysis, metalwork, and industrial design.
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